Automatic Load/Unload Multi-function Automatic Speed Die Bonder
规格 Specifications
基本功能 Basic Functions
作业系统Operating system:Windows XP
操作界面Operation interface:中文界面及触摸屏操作Chinese user interface and touch screen
工作周期时间 Cycle time: 240msec(最快max){15k/h}
定位精度 Placement accuracy:±1.5mil
角度精度Angular accuracy: ±3°
晶片尺寸Applicable die size : 6mil×6mil~100mil×100mil
支持支架 Applicable workholders: 平面LED灯Horizontal LED lamp.
SMD(0603 0805).TOP SMD(3528 5050). 大功率High Power LED
双视觉系统: 精确及可调晶片图像识别定位系统
Dual vision system: Precise and modulated pattern recognition system
电源Power supply: 220V±10V.50Hz, 1.7KW
空气源（压力）Air source(Pressure):3~5kg/cm2
其他功能及配置Other features and configuration:
多晶元独立控制Multi-Wafer absolute control
漏晶检测 Missing die detection
无限程序储存数量Unlimited program storage
LCD彩色显示屏LCD color monitors
内置式真空发生系统Internal vacuum pump system
内置不间断电源系统（UPS）（可选）Internal Uninterrupated Power Supply(UPS){optional}
Dimensions and Weight体积和重量
体积[长×宽×高]Dimensions[L×W×H]:1000mm×900mm×1600mm]
重量Weight: 800kg
Bonding System固晶系统
固晶头Bond head: 表面吸取式Die surface picking
固晶臂Bond arm: 90°旋转rotated
固晶力度Bond force: 20g~200g
Wafer XY Table 芯片XY工作台
最大行程Maximum XY distance: 8″×8″[205mm×205mm]
精确度Accuracy: ±0.3mil
复测精度Repeatability: ±0.2mil
晶片环尺寸Wafer size: ￠6″
顶针行程Ejector traveling distance: 3mm(最高max)
Work holder固晶工作台
最大XY距离Maximum XY distance: 4″×8.5″（105mm×220mm）
精确度Accuracy: ±0.3mil
重复性Repeatability: ±0.2mil
自动上下料系统Automatic Load/Unload system
双收料盒移动互换工作 Pipelined operation with two interchangeable magazines
