钨钼铜合金衬底具有仅次于SiC衬底的导热率，但是成本却远低于SiC。并且钨铜合金具有耐高温、低膨胀系数、比热容高、机械加工性能好、容易制成镜面等优点，是大功率LED芯片散热衬底的优良选择！
| 材质 Composition |
W: 85±1 wt%; Cu: balance | W: 89±1 wt%; Cu: balance | ||||||
| Item | 2 inch | 4 inch | 5 inch | 6 inch | 2 inch | 4 inch | 5 inch | 6 inch |
| 直徑 Diameter (mm) |
50.8 mm 2 inch |
101.6 mm 4 inch |
127 mm 5 inch |
152.4 mm 6 inch |
50.8 mm 2 inch |
101.6 mm 4 inch |
127 mm 5 inch |
152.4 mm 6 inch |
| 厚度 Thickness (μm) |
100~200 ±10 |
100~200 ± 10 |
100~200 ± 10 |
100~200 ± 10 |
100~200 ±10 |
100~200 ± 10 |
100~200 ± 10 |
100~200 ± 10 |
| 供货状态 Delivery State |
退火态; Annealed | |||||||
| 表面状态 Surface State |
轧制表面, 类镜面，磨光表面，电镀表面，(按照客户要求). Rolled surface，like mirror surface，grinding surface,plating surface. (according to the buyer's required) |
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| 表面粗糙度 Surface roughness, Ra (μm) |
0.04～0.1 | |||||||
| 平面度 Flatness (μm) |
20～50 | 50~80 | 80~100 | 100~150 | 20～50 | 50~80 | 80~100 | 100~150 |
| TTV Total Thickness Variation(μm) |
2～15 | |||||||
| 密度 Density (g/cm3) |
16.25~16.50 | 16.75~17.00 | ||||||
| 相对密度 Relative Density %TD |
>99% | |||||||
| 热膨胀系数 Coefficient of Thrmal Expansion(10-6/K) | 5.4~5.8 | 5.2~5.6 | ||||||
| 热导率 Thermal Conductivity (W/mK) |
180～200 | 170～190 | ||||||
| 比热容 Specific Heat Capacity (J/kgK) |
175 | 155 | ||||||
| 维氏硬度 Vickers Hardness (HV10) |
230~350 | 250~380 | ||||||
