陶瓷/矽基板金属化电路板设计加工： 陶瓷基板：氧化铝电路板、氮化铝电路板、矽晶圆电路板。 陶瓷金属化：金、银、铜、镍、钛…等贵金属及电路。 薄膜及厚膜技术：0.1um-5mil以上。 LED散热陶瓷电路板 LED 氧化铝薄膜电路板 LED 氧化铝厚膜电路板 LED 氮化铝薄膜高散热传导电路板 覆晶封装基板设计制造 薄膜/厚膜/电镀/无电镀制程整合设计加工 产品应用： 高功率LED陶瓷基板 微波无线通讯 HCPV太阳畜电池 陶瓷传感器基板 半导体及军事电子领域 其它…如Reble公版 Ceramic metallized: Ti/W,gold(Au), sliver(Ag),Copper(Cu),nickel(Ni)…others & produce final circuit coating:0.03um to 5mil Ceramic Metallized substrate: Al2O3 substrate metallized AlN substrate metallized Silicon wafer metallized LED heat-dissipation ceramic substrate: LED Al2O3 thin film substrate LED Al2O3 thick film substrate LED AlN thin film heat-dissipation substrate Flip chip substrate: The integration of the thin film,thick film,electrode plating and electroless plating processes: Application: 1. High Power LED ceramic substrate 2. Microwave (Wireless Communication & Radar) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles 6.Flip chip/eutectic substrate 7.Sensor ceramic substrate |
|
|
