（平面式高速固晶机）
（周期：60ms）
适用于2121,3014及2835,5050等
一、机型特性
1.采用国际领先的双固晶，双点胶，双晶片搜寻系统；
2.采用直驱电机驱动邦头；
3.采用线性电机驱动搜寻晶片平台（X/Y）与送料平台（B/C）；
4.采用可程式恒温点胶系统；
5.采用真空漏晶检测；
6.支架采用叠片式上料（免装料盒），有效提高了生产效率；
7.工控机控制设备运行，简化了自动化设备的操作；
8.精准的自动化设备为企业提高生产效率，降低成本提供了有效保障，从而切实有效地提高了企业竞争力；
9.精准的固晶位置及优良的一致性为后道工序提供了先天的保障。
Cycle: 60ms
It is compatible with 2121、3014、2835 and 5050 etc.
Product Features
1. International leading double die bond, double adhesive dispense and double die searching system;
2. Linear motor is applied to drive bond head;
3. Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);
4. Programmed control constant-temperature adhesive dispensing system is also applied;
5. Vacuum die missing testing technology is adopted;
6. Stacking holders for loading (free-loading magazine) is applied to improve the production efficiency largely;
7. IPC will control the operation of equipment, simplifying the operation of automation equipment;
8. Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;
9. Precise die bond location and excellent compatibility will guarantee the back-end processing.
二、规格参数
Specifications and Parameters
1.系统功能/System Function | 4、吸晶摆臂机械手系统/Die Bonder’s Swing Arm-and-hand system | ||
生产周期 /Production Cycle | 50ms 周期取决于晶片尺寸及支架 (Depending On Die Size And Holder) | 吸晶摆臂/Swing Arm of Die Bonder | 90°可旋转固晶 (Rotatable Die Bond) |
XY位置精度/Accuracy | ±1mil(±0.025mm） | 吸晶压力/Die Bond Pressure | 可调20g—250g (Adjustable) |
芯片旋转/Die Rotation | ±3° | 5.送料工作平台/Loading Workbench | |
2.芯片XY工作台/Die XY Workbench | 行程范围/Range of Stroke | 170mm*75mm | |
芯片尺寸/Die Dimensions | 3mil×3mil-80mil×80mil | XY分辨率/XY Resolution | 0.02mil(0.5μm) |
6.适用支架尺寸/Suitable Holder’s Size | |||
晶片最大角度修正 /Max. Angle Correction | ±15°（选配）(Optional) | 支架长度/Length | 120mm ~ 170mm |
芯片环尺寸 /Max. Die Ring Size | 6″（152mm） 外径(External Diameter) | 支架宽度/Width | 48mm~ 75mm |
芯片面积尺寸/Max. Die Area | 4.7″（119mm）扩张后(Expanded) | 7.所需设施/Facilities Needed | |
分辨率/Resolution Ratio | 0.04mil (1μm) | 电压/频率/Voltage/Frequency | 220V AC±5%/50HZ |
顶针Z高度行程/Thimble Z Height Stroke | 80mil（2mm） | 压缩空气/Compressed Air | 0.5MPa（MIN） |
额定功率/Rated Power | 950W | ||
3.图像识别系统/Image Recognition System | 耗气量/Gas Consumption | 5L/min | |
灰阶度/Grey Scale | 256级灰度(Level Grey) | 8.体积及重量/Volume and Weight | |
分辨率/Resolution | 656×492像素(Pixels) | 长x宽x高/ Length x Width x Height | 135×89×180cm |
图像识别精准度 /Image Recognition Accuracy | ±0.025mil@50mil观测范围(Observation Range) | 重量/Weight | 1120kg |