1 Introduction
Die Attach Paste ”KEMITITE CT285” is epoxy resin based and solvent free Type paste.
The highest thermal conductivity (25W/mK)
Good reflow performance due lower moisture absorption resin system.
CT285 is effectively used for power IC, transistor.
2 Features
1） Good workability for dispensing due to solvent free and one liquid type paste.
2） Highest thermal conductivity(25W/mK)
3） Bleed less.
3 General Property
|
Properties |
Unit |
Typical Value |
Test Method |
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|
Appearance |
– |
Silver Filled Paste |
Visual |
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|
Viscosity at 25C |
Pa·s |
100 |
EHD Viscometer 0.5rpm (3°cone) |
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|
Thixotropic Index |
– |
6.0 |
0.5rpm/2.5rpm |
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|
Non Voletile |
Wt% |
92.0 |
180C×2hr |
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|
Silver Content |
Wt% |
87.5 |
600C×3hr |
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|
Adhesive Strength |
25C 300C |
N |
30 20 |
frame: Cu/PPF Chip Size: 2×2mm |
|
|
Volume Resistivity |
Ohm.cm |
8×10-6 |
Cure: 200C×90min Measurement: Room Temp |
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|
Glass Transition Temperature |
C |
200 |
TMA |
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|
Modulus(25C) |
25C |
GPa |
16.5 |
DMA |
|
|
260C |
7.8 |
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|
CTE |
Alpha 1 |
Ppm |
75 |
TMA |
|
|
Alpha 2 |
200 |
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|
Ionic Impurity |
Na |
ppm |
6 1 |
Atomic Absorption Ionchromatography |
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|
CI |
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Thermal Conductivity |
W/m K |
25 |
Laser Flash |
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4. Standard Cure Condition
175C×60-90min
5. Remarks
Storage condition is _30 to _15C 6 month
CAUTION: Property values listed are typical values. The data herein is for information only.
