1.84-1LMISR4DEscriptION
Ablebond® 84-1LMISR4 electrically conductive die attach adhesive has been formulated for use in high throughput, automatic die attach equipment. The rheology of Ablebond
84-1LMISR4 adhesive allows minimum adhesive dispense and die put down dwell times, without tailing or stringing problems. The unique combination of adhesive properties makes Ablebond 84-1LMISR4 adhesive one of the most widely used die attach materials in the semiconductor industry.
2.84-1LMISR4FEATURES
• Excellent dispensability with minimal tailing and stringing
• Box oven cure
