产品特性Product Characteristics
★高热导陶瓷基板，芯片所产生的热量可迅速通过陶瓷基板向外传导
Highly-conductive ceramic baseplate, heat produced by the chips could be spread out promptly by the baseplate.
★高可靠性，额定工作电流下，5000小时衰减低于3%
High reliability, decay less than 5% after 3000 hours at rated working current.
★发光均匀，光线柔和，无眩光，无光斑
Even and soft light radiation, no glaring and no lighting spot.
★高显色指数，高发光效率
High CRI (Color Rendering index) and high lighting efficiency.
★组装方便，可自由搭配和组合，无需PCB板，直接接触散热片
Easy assembly and can be combined, do not need the PCB board, immediate contact radiator fin.
